1·Finally the life of CSP solder joint based on Pb-free material 95.
基于三维有限元分析方法预测热循环条件下焊点的疲劳寿命，对无铅材料95。
2·Ball Valves Threaded, Socket-Welding, Solder Joint, Grooved and Flared Ends.
球阀线程，插焊，焊点，槽和扩口端。
3·Therefore, it is necessary to study the reliability of this mixed solder joint.
因此，有必要对这种混合焊点进行可靠性分析。
4·The results are of importance to design and optimize of geometry shape of the solder joint.
这一结果对于焊点几何形态的设计及优化具有指导意义。
5·Thermal fatigue Random variable Probabilistic analysis Solder joint Lognormal distribution;
热疲劳； 随机变量； 概率分析； 焊点； 对数正态分布；
6·And the different section shape of the solder joint is given with the variation of solder volume.
给出了不同的钎料量对应的焊点剖面形态的变化。
7·So the drop impact reliability of solder joint is the key content of unleaded portable electronic products.
因此，焊点跌落可靠性是无铅便携式电子产品可靠性的关键内容。
8·The effect of gas hole location on SMT solder joint fatigue life has been analyzed by finite element method .
分析发现，与无缺陷焊点相比，气孔使焊点中应力应变分布发生了改变，使焊点疲劳寿命缩短；
9·The welding quality of the solder joint on the conducting wire connected with the soldering cover and the PCB.
导线在接插件焊杯内的焊点和导线在印制板上的焊点的焊接质量。
10·In the microelectronic packaging, the reliability of the solder joint has been being a forward position and a hot topic.
电子封装中的的焊点可靠性问题一直是电子封装中学科的前沿和热点问题。